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Failure Analysis and Inspection for IC
In order to our customers to get satisfactory of our product as compound
functions and High performance and precision for IC, ARKTAKE,inc. set-up
the section for technical support and product quality controls.
- Functional test and access time measurement for Memory IC's.
- Investigation of failure cause of the line receiver driver IC.
- Evaluation of maker's specification and application of user's circuits for OP amp etc.
- Decaplation, observation of Die surface and photo for IC's.
Burn out by electrical overstress.
Scratch, chips, Die color and etc.
Corrosion of aluminum pattern.
Die bonding and wire bonding
Shortage of junction
Migration
- Measurement of AC parameter for Digital IC.
- Failure analysis for ADC. DAC, etc..
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- Screening of the offset voltage of OP amp.
- Screening of popcorn noise of OP amp.
- Functional test for memory ICs.
- Testing of power supply ICs.
- Screening of hFE and the breakdown voltage of transistors.
- Investigation of the distribution among lots about DC and AC parameters of ICs.
Please feel free to ask regards to not inform that in the data sheets for inspection
and screening.
In the Failure Analysis, we provide the report for electrical
investigation result, photo image for observation of IC
chip surface, estimate failures factor, updated measures.
For your inquiry, please go to inquiry page. We
will return to you A.S.A.P. |
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